Descriptions:
The multi-purpose blade is for removing BGA ICs, CPU chips, NAND and removing adhesive around ICs.
The blade is made of flexible steel, does not deform and is resistant to heat as well as high and very low temperatures, does not stick to tin and can separate tin points, anti-oxidation, corrosion resistance, resistance to Wear is one of the distinctive features of this blade.
How to use:
1: When removing the chip, first clean the edge glue in the cutting area and the black glue around the chip.
2: Turn on the heat gun or heater to 150 degrees and use the air outlet, wind speed to preheat the motherboard for 2 minutes.
3: Replace the head of the heat gun or heater with a small one, set the temperature to 350 degrees, then shake the blade left and right and insert it from the bottom of the chip.
Note: When the blade wobbles left and right and cannot be inserted, it means that the soldered or adhesive points have not melted yet. after melting
Application:
To disassemble and repair mobile phone CPU
Motherboard repair
Hardware repair
Instrument repair
To remove solder joints
SSD solid state drive
flash memory
Other chips
Remove the IC
Cleaning the glue under all the chips
Specifications:
Blade material: steel
Handle material: aluminum alloy + thermoplastic pipe
Size: 178x95x15 mm